good quality Red resin SMT welding adhesive，resin adhesive,FUJI SEALGLUE,SMT adhesive produce excellent soldering performance

SHENZHEN BBIEN TECHNOLOGY LIMITED

RED GLUE ADHESIVE HAVE THE FOLLOWING FEATURE:

Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very small dots.
Stable adhesive strength can be obtained with a variety of SMD.
Long-term preservation stability is expected.
High heat-resistivity and excellent electric properties are possessed.
Usable for screen printing.
1)      Much lower temperature curing is aimed at amd is practically possible.
2)      Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very amall dots.
3)    stable adhesive strength can be obtained with a variety of SMD.
4)   Long-term preservation stability is expected.
5)      High heat-resistivity and excellent electric properties are possessed.

SHENZHEN BBIEN TECHNOLOGY LIMITED PRODUCE 200ML 300ML STENCIL RED GLUE ADHESIVE,THE SPECIFICATION AS FOLLOWING:

SMT is a kind of single epoxy resin adhesive .
1)Usable for screen printing.
2)High heat-resistivity
3)high speed dispensin
polyesthylene SMT red glueis a kind of single epoxy resin adhesive .Good stable curing shapes without stringing, overflowing and slumping are achieved even at a super high speed and long time printing. Because of the “rarely cutting” bonding strength and very low humidity absorption, it is specially fit for SMT technology of porous printing in common temperature. Its shape can easily be controlled .We can not only expect a long-term preservation stability but also the excellent thermal resistance and electrical properties. Moreover it is good for environment protection for its safety, no solvent and no smelling.

Typical Uncured Properties	red adhesive1	2
Composition	Epoxy	Epoxy
Specific Gravity (g/cc), ASTM-D-792	1.15 – 1.35	1.26 – 1.32
Viscosity, ASTM-D-1824 (RVT spindle #7) cps @ 1 rpm cps @ 10 rpm	150,000 - 240,000 25,000 – 45,000	2,000,000 – 3,000,000 230,000 – 450,000
Color	Red	Red
Thixotropic index, ASTM D-1824	>6.0	>6.0
Dot profile, width/height	<2.0	<2.0
Particle Size (ì)	<25	<25

CURE SPEED VS. TEMPERATURE
The following graph shows the rate of torque strength developed with time at different temperatures. These times are
defined from the moment the adhesive reaches cure temperature. In practice, total oven time may be longer to allow
for heat up period.

GUIDELINES FOR HANDLING EPIBOND®SURFACE MOUNT ADHESIVES

REWORKING
Once cured, Epibond®adhesives can be removed from a printed circuit board by heating the board to approximately
80°C (176°F to 185oF). When the temperature of the surface mount component reaches 80°C (176°F), the adhesive
will be soft enough to permit component removal using a "lift and twist" method.

After removing the component, reapply heat to any remaining adhesive until it is soft. Residual material can then be
scraped off the board surfaceINK16'>

SHENZHEN BBIEN TECHNOLOGY LIMITED PRODUCE kinds of Epibond-Series Surface Mount Adhesives are designed for holding in place bottom side – and some mixed technology – surface mount components during the wave soldering process. Epibond are high-quality non-slumping and non-stringing surface mount technology adhesives applied by dot dispensing, printing equipment and pin transfer, giving consistent dot profile and fast curing.

CLEANING
Uncured adhesives can be easily removed from printed circuit boards, screens or stencils using Alpha SM-110,
isopropyl alcohol, acetone, NMP and a wide variety of other solvents and cleaning fluids. Huntsman Advanced
Materials is constantly working with manufacturers of solvents and cleaning fluids to test and identify new materials
that meet the needs of our customers. For an updated list of suggested cleaning materials, please contact the
Huntsman Product Information Hotline at 800-331-6810.
Note:
○Shelf life:6Months.

○Store adhesive in a refrigerator keeping the temperature at 5±3℃

○This product may cause skin irritation to sensitive personnel.

○In case Seal-glo DTK-L978 gets in touch with skin,wash it thoroughly with soap and water.

○In case of eye contact,wash out with clean water and consult a medical doctor immediately.

Package styles

Package styles	Contents	Pack.Unit	Applicable Dispenser Makers
1． Tube	100gr	10Pcs.	For all
2．tube	300ml	5Pcs.	For all
3．tube/syringe packing	350gr	12Pcs	For all
4． PLASTIC JAR	360gr	12Pcs	For all
5． PLASTIC JAR	500gr	10Pcs	For all

Composition	SMT Epoxy resin
Appearance	Paste/red-colored
Specific gravity	1.25
Viscosity at 25°C,5rpm	350Pa·S
Thixotropy index	6.8(1rpm/10rpm)
Adhesive Strength 2125C Mini-mold tr SOP·IC 16P	44N(4.5kgf)0.2mgr twin 45N(4.6kgf)0.3mgr twin 92N(9.4kgf)0.8mgf single×2
Electric Property Volume resistance Insulation resistance Initial value After treating* Dielectric constant Dielectric loss tangent	3.6×10¹⁶Ω·cm JIS K6911 1.2×10¹⁴Ω JIS Z3197 1.2×10¹²Ω 3.12/1MHZ JIS K6911 0.012/1MHZ JIS K6911
Preservation condition	10°C To be strictly kept at less than 10°C in refrigerator

SHENZHEN BBIEN TECHNOLOGY LIMITED

Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very small dots.