Epibond Surface Mount Adhesives also caleed ，resin adhesive,FUJI SEALGLUE,SMT adhesive produce excellent soldering performance

surface mount adhesives offer excellent performance for all SMT surface mount printing print and dispensing applications.

·                Consistent high-dot profile and fast curing.
·                Room temperature stability, 6-month room temperature shelf life.
·                Non slumping and non stringing.
·                Dispense, print and pin transfer application.
·                High-visibility red or yellow options.
·                Screen printable with BBIEN® CUT laser stencils to SMD adhesive guidelines.
Other characteristics
1.      Much lower temperature curing is aimed at amd is practically possible.
2.      Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very amall dots.
3.      stable adhesive strength can be obtained with a variety of SMD.
4.      Long-term preservation stability is expected.
5.      High heat-resistivity and excellent electric properties are possessed.
6.      Usable for screen printing.

SHENZHEN BBIEN TECHNOLOGY LIMITED's polyesthylene SMT red glueis a kind of single epoxy resin adhesive .Good stable curing shapes without stringing, overflowing and slumping are achieved even at a super high speed and long time printing. Because of the “rarely cutting” bonding strength and very low humidity absorption, it is specially fit for SMT technology of porous printing in common temperature. Its shape can easily be controlled .We can not only expect a long-term preservation stability but also the excellent thermal resistance and electrical properties. Moreover it is good for environment protection for its safety, no solvent and no smelling.

Clients resource: our SMT red glue adhesiveIran have been exported to Turkey,America,Morocco,... We are appreciated your kindly inquiry or cooperate with you,if you are interested in our products.

Epibond-Series Surface Mount Adhesives are designed for holding in place bottom side – and some mixed technology – surface mount components during the wave soldering process. Epibond are high-quality non-slumping and non-stringing surface mount technology adhesives applied by dot dispensing, printing equipment and pin transfer, giving consistent dot profile and fast curing.
Epibond® Surface Mount Adhesives Typical Cure Profile

A correct thermal profile is critical to ensure that the adhesive achieves maximum mechanical strength and a homogeneous cure:
· Ensure the material is heated to the correct temperature for the specific time.
· maximum thermal ramp rate is 1.5 to 2.0°C/second to ensure a homogeneous cure.

Smt red gel provides the following product characteristics:
Description:

Technology	Epoxy
Chemical Type	Epoxy
Appearance (uncured)	Red viscous gel
Components	One component - requires no mixing
Cure	Heat Cure
Application	Surface Mount Adhesive
Key Substrates	Electronic components to printed circuit boards.
Other Application Areas	Small Parts Bonding
Dispense Method	Stencil print
Wet Strength	High
Dot Profile	Peaked

Composition	：Epoxy resin
Appearance	： Paste/red-colored
Specific gravity	1.31
Viscosity at 25℃,5rpm	280,000mPa·S(280,000cps)
Thixotropy index	6.8(1rpm/10rpm)
Adhesive Strength 2125C Mini-mold tr SOP·IC 16P	44N(4.5kgf)0.2mgr twin 45N(4.6kgf)0.3mgr twin 92N(9.4kgf)0.8mgf single×2
Electric Property Volume resistance Insulation resistance Initial value After treating* Dielectric constant Dielectric loss tangent	3.6×10¹⁶Ω·cm JIS K6911 1.2×10¹⁴Ω JIS Z3197 1.2×10¹²Ω 3.12/1MHZ JIS K6911 0.012/1MHZ JIS K6911
Storage condition	below 10℃ To be strictly kept at less than 10℃in refrigerator

BBIEN technology LTD Direction for use
1. After storage in a refrigerator the adhesive must be allowed to equilibrate to room temperature before use, typically 12 hours.
2. Avoid cross contamination with other epoxy or acrylic adhesives by ensuring dispense nozzels, adapters etc. are thoroughly cleaned.
3. The quantity of adhesive dispensed will depend on the dispense pressure, time, nozzle size and temperature.
4. These parameters will vary depending on the type of dispensing system use and should be optimised accordingly.
5. Bath temperature should ideally be controlled at a value between 25°C-30°C, 50%RH for optimum results. Under these conditions product will remain dispensable in the tray for at least 2 to 3 days.
6. Uncured adhesive can be cleaned from the board with isopropanol, MEK or glycol ether blends such as Prozon.
Application :component epoxy resin adhesives
Epoxy 1-component adhesives are heat curing and primarily used when high shear strength or high crash-resistance is required, as well as ease of working.
Note:Curing conditionnt
-->○Recommended curing condition:Over 60 sec after PCB’s surface temperature has reached 150℃.or over 90 sec after PCB’s surface temperature has reached 120℃.

○When the higher curing temperature and the longer curing time,the stronger adhesive strength can obtained.We would suggest you to search out an optimum curing condition,for the temperature exerterd on the adhesive may occasionally vary according to the size,material,etc.of component parts mounted on PCBs.

Package styles

Package styles	Contents	Pack.Unit	Applicable Dispenser Makers
1． Tube	100gr	10Pcs.	For all
2．syringe/tube	300ml	5Pcs.	For all
3．column	350gr	12Pcs	For all
4． PLASTIC JAR	360gr	12Pcs	For all
5． PLASTIC JAR	500gr	10Pcs	For all

Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. Products shall be maintained, optimally, at temperatures between 2°C to 8°C unless otherwise labeled, or, specified. Storage, at temperatures below 2°C, or, greater than 8°C, is not recommended. Temperatures below 2°C and above 8°C can adversely affect product properties.

How to use
○SHENZHEN BBIEN TECHNOLOGY LIMITED Adhesive should be preserved in refrigerator(below 5±3℃)to keep on its quality.

○Before processing,the adhesive should be taken out from the refrigerator for de-freezing about a few hours until it reaching the room temperature.

○The bottom of printing screen should be cleaned timely for good printing shape.

○Toluene or ethyl acetate is possible to use for cleaning up this adhesive.