100g and 10CC no clean lead free BGA tacky paste flux
100g and 10CC no clean lead free BGA tacky paste flux
SHENZHEN BBIEN TECHNOLOGY LIMITED supplies100g per jar or 10CC per syringe no clean lead free BGA tacky paste flux;we have BGA flux,tacky paste flux,no clean paste flux,lead free tacky paste flux.It match with solder wire used together.
BBIEN lead free tacky paste flux is formulated to meet the exacting performance and quality requirements of printed circuit board manufacturers. These versatile adhesives feature a unique combination of physical characteristics including:
Consistent, high dot profile
Good green strength
Fast curing
Six-month shelf life at 68°F (20°C) room temperature
Nine-month shelf life at 32°F (0°C)
Resists slumping and stringing with high (>6.0) thixotropic index
Meets IPC-SM-817 Requiements
Performance characterisitic:
Compatible with Lead Free alloys such as
· Reflow-able with peak temperatures up to 270 °C
· Reflow-able in air and nitrogen
· Bright shiny soldered joints with clear residues
· Aggressive flux on various substrates such as
OSP-Cu, Immersion finishes and ENIG
· Clear non-tacky residues
· High tack to minimize skewing of components
· Low voiding
· Stencil Life of 8+ hours (process dependent)
· Classified as ROL0 per J-STD-004
· Compliant to Bellcore GR-78
Cleaning:
TF LF-01 Tacky paste fluxis a no-clean chemistry. The residues do not need to be removed for typical applications. If
residue removal is required, call our Technical Support.
Specification in details
TF LF-01 Tacky paste flux Introduction:
TF HF-01,tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. It is RoHS standars,halogen- free type of tacky flux. TF LF-01 Tacky paste fluxare used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and m BGA packages. Operations such as soldering Flip Chip components to various PCB substrates also use TF. TF LF-01 Tacky paste fluxis available in water soluble, no-clean and RMA formulations and can be dot dispensed, screen printed or stencil printed. Available in 10cc syringe; 100g jars; with other sizes available upon request.
PHYSICAL PROPERTIES Specification
The basic physical characteristics
Project |
Test results |
Appearance |
Light yellow/white tacky paste flux |
Smell |
Not fit for |
Physical stability |
By:5±2 ºC No layered or crystallization precipitation,45±2 ºC no layering phenomenon |
Solid content |
6.20.2% |
Proportion |
0.80±0.05 |
Acid value |
19.2 ±1.0 mgKOH/g |
Halogen content |
No |
Reliability performance
Project |
Technical requirements |
Test result |
Water extract resistivity |
JIS Z3197-86
JIS Z3283-86 |
By:5.0×104 ohm·cm |
Bronze corrosion |
IPC-TM-650 2.3.32 |
Pass |
Viscosity: |
/ |
400-580 kPa. |
AgCrO4 |
IPC-TM-650 2.3.33 |
Pass |
Halogen content |
JIS Z3197-86
JIS Z3283-86 |
Pass |
Surface insulation resistance
Standard test |
Conditions |
Standard |
Test result |
IPC-TM-650
2.6.3.3 |
40ºC, 95% RH, 96h |
> 1.0×1011 Ohms |
4.9×1011 |
Application:
THF-01 Tacky paste fluxis a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux.TF LF-01 Tacky paste fluxalso can be used for some lead free solder wire,which can achive the better welding effect.
Application notes:
Standard Applications:
TF LF-01 Tacky paste fluxis designed for stencil/screen printing, rotating drum, slide fluxers and/or syringe applications.
Great for rework applications on all PCB packages of various electronic devices. TF LF-01 Tacky paste fluxis great for rework applications on all PCB packages.
TF LF-01 Tacky paste fluxcan be used in BGA/PGA sphere/pin attachment vehicle or for repair and reballing/repinning. This flux works on flip chip, chip scale package and flip chip bumping sites assemblies as a soldering paste flux.
SHENZHEN BBIEN TECHNOLOGY LIMITED TF LF-01 Tacky paste flux could be classified as can/bottle packing and syringe packing type.
Each can/bottle holds the tacky pastes flux is 100g;
Each syringe can load the tacky paste flux is 30g or 10CC
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.
Specification |
Tacky paste BGA flux |
Appearance |
White or slight yellow tacky paste |
Weight |
100g/jar;20jars inner foam carton,paper carton of out pakage
30g/syringe,100syring/carton |
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for TF LF-01 Tacky paste fluxto maintain consistent viscosity,reflow characteristics and overall performance.TF LF-01 Tacky paste fluxshould be stabilized at room temperature prior to printing. TF LF-01 Tacky paste flux fluxshould be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6-10 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.