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Halogen paste flux with high viscosity
Halogen paste flux with high viscosity
TF-CH02 no clean tacky paste flux is a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces.
TF-CH02 tacky paste fluxis a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces.It contain activated halogen element, which make soldering result better. The robust wetting action of TF-CH02 tacky paste fluxwill allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles.
We have 100g per jar/can packing; as well as 30g(10CC) per syringe packing.
TF-CH02 tacky paste fluxis a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces.It contain activated halogen element, which make soldering result better. The robust wetting action of TF-CH02 tacky paste fluxwill allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles.
We have 100g per jar/can packing; as well as 30g(10CC) per syringe packing.
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Performance Characteristics:
· Stencil life: 8 hours (process dependent)
· Excellent printing characteristics to <16mil pitch
· Leaves bright/shiny solder joints after reflow
· Can reflow in air or nitrogen environments
· Classified as ROL1 per J-STD-004
· Compliant to Bellcore GR-7
分为ROL1/ J-STD-004
Cleaning:
TF LF-01 Tacky paste fluxis a no-clean chemistry. The residues do not need to be removed for typical applications. If
residue removal is required, call our Technical Support.
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