led free core wire,tin materials0.1mm 0.6mm water soluble silver copper tin wire of Sn96.5Ag3.0Cu0.5 no clean tin lead free solder wire with shinny welding point and good conductivity

Feature:
.High temperature anti-oxygen
.Satisfactory soldering joint and favorable fluidity.

Solder joints are filled, and firm. Both RA and RMA are made in complicance with IPC J-STD-006 and JIS Z3283 class AA standards. All these solder flux can be dissolved in solvent, featuring a little smoke and very few splatters.
Diameter:0.1mm(0.1mm,0.2mm,0.3mm 0.4mm,0.5mm,0.8mm,1.0mm…)

Very fast wetting
Very low flux spatter
Good spread characteristics
Very low levels of fumes
Clear non-tacky residue
Provides good joint appearance
Halogen and Halide Free

Low Cycle times for component touch-up and manual assembly
Safe to use, Operator Friendly, Less Residues on Boards
Excellent First Pass Solder Joints. JIS Spread ≥ 80%.
Cleaner Working Environment, Less Extraction Maintenance
No-Clean Residues, Useful for all Applications
Makes Inspection easy
Environmental compliance and High Electrical Reliability

Its clear residue allows easy inspection of solder joints and the very low spatter rate ensures board cosmetics and user comfort are maintained. All this translates to a safe and environmentally compliant product that is operator friendly while maintaining high levels of productivity.
Packing

Specification				Sn99-Ag3.0-Cu0.5
Appearance				Lucent, no dirt on surface
Weight				250g,500g,1kg,2kg/roll，10kg/carton；500g/roll, 10kg/ctn
Chemistry metal component
Sn	Ag	Cu	Pb		Sb	Bi	Zn	Fe	Al	As	Cd
96.5+/-1	3.0+/-0.5	0.5±0.1	<0.01		<0.02	<0.01	<0.003	<0.02	<0.001	<0.03	<0.002

physical property

Alloy component	Melting point	Proposion g/cm³	Rigidity HB	Conduct heat M.S.K	Extend Mpa	Extend rate %	Conductivity %
Sn96.5Ag3.0Cu0.5	227	7.4	9	64	32	48	16.0

Product Type	Silver Solder wire Sn96.5Ag3.0Cu0.5
Brand	BBIEN
Material	Tin-silver-Copper alloy, Sn,Ag,Cu
Composition	Sn,Ag,Cu
Melt point	217
Flux content	2.0% or solid
Application	Metal soldering
Density (g/m^3)	8.3
Diameter	0.1mm,0.2mm,0.3mm,0.4mm,0.5mm，0.7mm,0.8mm,1.0mm,1.2mm,1.5mm.2.0mm.3.0mm
Weight	1000g/pcs,500g/reel,250g/reel
Type	flux core solder wire or no flux core
Place of origin	Shenzhen,Dongguan city
Certificate	SGS
Keyword	lead free silver solder wire
	Solder wire
	Solder

Application notes

Sn96.5Ag3.0Cu0.5 lead free no clean solder wire is specifies compliance to the IPC J-STD-004B ROL0 standard.
It is ideal for electronic assemblies used in tomotive, Consumer Electronics, Computer and peripherals, Mobile devices and all types of Au household appliance applications.As well as apply to High-precision medical instrumentation.

Application notes:
·Use a soldering iron tip size and form to suit the operation: small tips for soldering large components may prevent the
formation of a joint or slow the process down.

·Select a solder wire diameter to suit both the soldering iron tip and the parts/components to be soldered.
·Soldering iron systems should provide sufficient heat to satisfy the requirements of the points above.

·A typical solder tip temperature would be between 215°C and 235°C above the liquidus temperature of the alloy. The
ideal temperature to use is dependant on how thermally demanding the assembly is.

·Cored solder wires can be provided in different grades of alloy so always ensures that you have selected the right grade
for the application.

·Do not overheat as this causes an increase in the depth of the inter-metallic layer, which in turn weakens the joint.

amount of decomposition and fumes. These fumes should be adequately exhausted / vented for operator safety and comfort.

The tin solder wire could be classified as reel packing and tube packing type.
Each can/bottle holds the solder wire is 500g;
Each tube can load the solder wire is 13g/piece
Packing:

Specification	core solder wire/solid wire
Appearance	Bright alloy appearance
Packing	50g,100g,200g,250g,500g 500g,1kg,2kg per reel/bobbion；10kg/carton: 30kg/carton Tube packing:13g/tube Size of 10kg carton:36x18x8cm Size of 30kg carton:36x18x26cm

Other type of solder free solders

No clean lead-free solder	melting point °C	Tensile strength	elongation reat%	expansion rate%	Diameter	Application	Solder wire alloy	Solder bar/block alloy	Solder paste alloy	Solder powder alloy
Sn99.3Cu0.7	227	30	45	70	≥0.1mm	low cost, the most commonly used; Lead-free solder for general welding	yes	yes	yes	yes
Sn96.5Ag3.0Cu0.5	217	40	58	78	≥0.1mm	high cost, relatively bright spot; high performence Can be excellent for demanding welding	yes	yes	yes	yes

Sn99.0Ag0.3Cu0.7
Sn64Bi35Ag1	189	40	50	70		SMT,PCB	not	not	yes	yes
Sn62Pb36Ag2	189	38	54	75		SMT,PCB	not	not	yes	yes
Sn42Bi58	138	38	50	75	≥0.5mm	High cost	yes	yes	yes	yes