SACX0307 (Sn99Ag0.3Cu0.7)no clean lead free silver solder wire
lead free solder wire
SACX0307 (Sn99Ag0.3Cu0.7)no clean lead free silver solder wire
Shenzhen bbien Technology Ltd Sn99Ag0.3Cu0.7 acid flux core, no-Clean solder wire is a low residue flux core solder designed for hand soldering and to repair electronics applications. Sn99Ag0.3Cu0.7 flux core solder wire is a newly developed cored wire that is specifically designed to meet JIS Class AA requirements, with a halide content <1,000ppm, for no-clean lead-free applications.  It offers the balance of high SIR reliability and excellent spread characteristics.It is high temperature solder wire,which its melting point is 227degree.

Packing:spool packing,50g,100g,200g,250g,500g,1kg,2kg
tube packing:15g/tube,25g/tube
Sn99Ag0.3Cu0.7solder wire Feature:
BBIEN Tecnology Ltd's Sn99Ag0.3Cu0.7acid core lead free silver solder wire is fast wetting and low spattering characteristics make it excellent for manual assembly and drag soldering applications.

It is safe to use and operator friendly.  Inspection is also made easier by its clear residue.

--Fast melting,good wetting and expansibility.
--No break for the core,no splash and no odour.
--Good solderability and soldering joints with high brightness and strength.
--Good mechanical performance.
--Widely used in electronics,lighting,communication,radio,computer,instruments and other field.
--Residue is easy to remove by hot air after soldering work if necessary.
--Available in many alloy composition,other alloy composition are also available

The more informations about Sn99Ag0.3Cu0.7 high temperature meting lead free solder wire,please feel freely contact with Shenzhen BBIEN Technology Ltd
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