BBIEN Sn64Bi35Ag1 tin bismuth silver solid (no flux core)solder wire,178melting degree lead free solder wire

SHENZHEN BBIEN TECHNOLOGY LTD supply Sn64Bi35Ag1 tin bismuth silver solder wire,lead free low temperature solder wire,It has following feature.

Feature of Sn64Bi35Ag1 no flux core Bismuth solder wire

The most popular lead-free bismuth solder alloys are BBI-W104 (58Bi 42Sn) which melts at 138°C and BBI-W105 (Sn64-Bi35Ag1) which melts at 179°C. The addition of the 1% Ag makes the alloy more malleable. Both alloys can be used for step soldering applications. After the initial joints are made with a standard SAC alloy (220°C) subsequent soldering operations can be done using the bismuth alloys.
Sn64Bi35Ag Bi solder wire has joint properties similar to those of tin-lead solders, with superior fatigue and copper dissolution characteristics.
Bismuth is the most diamagnetic and the least thermally conductive of all metals
In addition to being non-toxic it does not oxidize as readily as lead does.

Feature of other solder wire is also available for Low temperature eutectic Tin Bismuth silver alloy:
Excellent scalability
High quality soldering wire on the market
Refined welding good fluidity, wetting, smoke spatter
Excellent First Pass Solder Joints. JIS Spread ≥ 80%.
Quick acting flue dissolves surface oxides for good wetting
Good solderability, insulation resistance, No spattering and Non-corrosive.
Widely used in electrical and electronics, solder parts like circuit board, electronics devices and others.

The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact with Shenzhen BBIEN Technology Ltd.

SHENZHEN BBIEN TECHNOLOGY LIMITED is an experienced and professional Chinese soldering manufacturer. We are specializing in research and development, production and selling of the soldering tin materials (solder wire, solder paste, solder bar/stick etc).

More than 10 years specialized in metal industry, BBIEN accumulated a lot of talent and technology, created international marketing network, for now, BBIEN have cooperated with many of oversea enterprises of over 80 countries around the world.e.g.America,Israel,India,Germany,Russia,Poland,LTU,Switzerland,Korea,Romannia,Bulgaria,Colombia,France etc.
Specification of Sn/Bi/Ag low temperature solder wire:
Item： Low temperature solder wire
Specification: BBI-W105(Sn64Bi35Ag1)
1. Purity and chemistry component

Specification	Sn64Bi35Ag1- no flux core solder wire
Appearance	Lucent,no dirt on surface
Weight	Net: 500g/case;1000g/case
Chemistry component
Elements Specification(%) Tested result(%WT) Sn 63.0~65.0 64.0 Ag 0.8~1.2 1.0 Al 0.005 0.0003 As 0.030 0.0060 Sb 0.050 0.0148 Bi Remainder Remainder Cu 0.080 0.0003 Fe 0.010 0.0003 In 0.050 0.0019 Ni 0.010 0.0007 Pb 0.050 0.0257 Cd 0.002 0.0002 Au 0.050 0.0010 Ag 0.050 0.0002
a. The above concentration of specification are in % weight. b. Single value listed are the maximum allowable standard. Flux content(%): 0 Diameter of wire: 0.5mm,0.6mm,0.8mm,1.0mm,1.2mm and 2.0mm

Physical feature of Sn64Bi35Ag1 solid solder wire

Alloy component	Melting point℃	Working temperature℃	Gravity g/cm³	Rigidity HB	Conduct heat M.S.K	Extend Mpa	Extend rate %	Conductivity %
Sn64Bi35Ag1	179	100~210	8.5~8.7	11~12	68	45	70-100	18.0

The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact with Shenzhen BBIEN Technology Ltd.

Sn64Bi35Ag1 and other tin bismuth wire Application:

Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework.
More and more requirment for middle and low temperature solder wire for moblie electronics,smart-home electronics..

The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more.

How to use tin-bismuth solder wire:
Step1:Prepare the solder station or gas woldering gun

Step2:Before welding, please clean electric solder iron,remove the tin dross, and then set the thermostat temperature reach to Sn64Bi35Ag1 solder wire's preheat temperature: 110 degrees to 150 degrees Celsius.
Stay automatic temperature rise to 179 degrees Celsius,which can be used to welding solder joints (before welding, you can take a small experiment, to ensure that the melting temperature can melt tin bismuth silver wire(Sn64Bi35Ag1), in order to avoid again when welding produce needless trouble).

Step 3:When the solder iron temperature or gas soldering gun temperature reaches 179 degrees Celsius, heating the Sn64Bi35Ag1 no flux core solder wire and used for circuit board solder joints (or other device being welding) welding heating.
When finishing to melt solder wire,it will get the fully soldering joints(Note: the Sn64Bi35Ag1 solder wire welding in the process,the peak temperature at 210 degrees to 230 degrees Celsius).

The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact with Shenzhen BBIEN Technology Ltd.

Packing of tin-bismuth-silver solder wire

Product Type	Solder wire Sn64Bi35Ag
Brand	BBIEN
Material	Tin-Bismuth-Silver alloy
Composition	tin64%,bismuth 35%,silver 1%
Melt point	179degree
Flux content	no flux
Application	Metal soldering,electronics
Density (g/m^3)	8.3
Diameter	0.5mm，0.7mm,0.8mm,1.0mm,1.2mm,2.0mm
Packing	500g/case,1kg/case
Type	no flux core solder wire
Place of origin	Shenzhen,Dongguan city

Keyword	Tin bismuth silver lead free no flux core solder wire
	Solder wire,tin bismuth solder wire,no flux core solder wire Sn64Bi35Ag1
	solder

The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact with Shenzhen BBIEN Technology Ltd.