0.8mm 1.0mm water soluble core wire of Sn63Pb37 no clean tin lead solder wire with shinny welding point and good conductivity

Feature:
1.       Favorable fatigue resistance and outstanding performance
2.       Ultra high electrical conductivity
3.       Mid-temperature soldering, characterized by nice softness and wonderful wetting property.
4.       .high-performance soldering flux, fast melting speed, good fluidity and quick speed to coat with tin.
5.       lower soldering flux spatter rate during soldering.
6.       Sldering flux is evenly distribution with good continuity.
7.       very little smoke and smell gas

In addition, Sn63Pb37 also have the following charateristics

Can applied in radio, communication, meters and instruments
Residue is easy to remove by hot air after soldering work if necessary
Available in many alloy compositions
Smooth surface, good fluid melting rate
Good mechanical performance, moisture and bright weld spot
Forms: bar and wire
Flux types: no-clean, rosin and water-soluble liquid
Tin solder, welding, lead-free solder bar and wires are also available
Very few scraps .

Sn-Pb37 flux core solder wire is the most common type of tin-lead alloy solder, which features the maximum dosage and demand. 63/37 tin lead welding wire represents that the alloy contain 63% tin content and 37% lead content in the solder, the diameter of Sn63Pb37 solder wire is from 0.35mm to 6.0mm. It is mid temperature solder wire which its melting point is 183degree Celsius. Sn63Pb37 no clean flux core solder wire can offer quite stable welding performance.

So far,our Sn63Pb37 core solder wire have been exported to Colombia, India, Pakistan, Romania etc.

Sn63Pb37 metal composition

Impurity content %

standard

Sn

Pb

Sb

Ag

Cu

Fe

Zn

Bi

Al

As

Ni

Cd

63±2

37+/2

≤0.10%

≤0.02%

0.1%

≤0.02%

≤0.001%

≤0.10%

≤0.001%

≤0.03%

≤0.01%

<0.01%

result

62

37.5

0.032

0.0002

0.0057

0.002

0.0015

0.006

0.0024

0.0021

0.0032

0.0001

Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,reflow characteristics and overall performance. 63/37 solder paste should be stabilized at room temperature prior to printing. It should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material.

Note:

How to chose solder
1.	Select the solder composition. First choose between leaded or lead free and then between high or low temperature. Choose high temperature for easily accessible connections and low temperature for smaller, crowded connections. Next choose the alloy. Leaded solder ranges from 40 percent tin and 60 percent lead (40/60) to 50/50, 60/40 and 63/37. The first number always represents the tin content; the higher the tin content, the lower the melting point. The most common lead-free solder contains 95 percent tin and 5 percent antimony but has a melting point between that of 40/60 and 50/50 tin/lead solder. Only experience will direct you in making exact choices for your application
2.	Select the diameter of the solder wire, from between 0.01 inch (0.25 mm) to 0.125 inch (3.25 mm). You must heat the metals to melt the solder as quickly as possible. The smaller the diameter of the solder wire, the faster it will melt. But if you choose too small of a diameter, you will not get enough solder on the joint in one pass. If you choose too large, excess heat may damage your components, or you may get a solder blob.
3.	Select flux core or no core. All solder joints need flux, which can be applied from a tube, with a brush, from the core of the solder or in any combination, depending on your personal style. But you must apply flux in one manner or another. The style you develop for soldering will determine the best choice for your application, but to be safe, always use a flux core so that you don’t forget.

Usage
Used in the electronics,copper plate, semiconductor ,Hard disk drive,Optics-electronic, LCD, IC, SMT, PCB ,Medical field and biotech industries.

Packing:

Specification	core solder wire/solid wire
Appearance	Bright alloy appearance
Packing	50g,100g,200g,250g,500g 500g,1kg,2kg per reel/bobbion；10kg/carton: 30kg/carton Tube packing:13g/tube Size of 10kg carton:36x18x8cm Size of 30kg carton:36x18x26cm

The Sn63Pb37 high temperature flux core tin lead solder wire could be classified as reel packing and tube packing type.
Each reel/bobbin holds the solder wire is 2kg,1kg,500g;250g,200g,100g,50g
10kg/carton
Each tube can load the solder wire is 13g/piece