Feature of BBIEN TECHNOLOGY Sn62Pb36Ag2 lead silver solder wire:
Nontoxic and environment friendly、Low melting point and stabilitytidiness surface and not easy to tienon-flux pollutionno dross residual.
 

1. Applied in the field of low temperature electronics surface mounting technology, Such as tin- Lead hand soldering, PCB secondary soldering. Application to thermal cut-off、thermal protector、Capacitors heating fuse, etc.

2. PHYSICAL CHARACTERISTICS                 :

    

   *ALLOY Sn62Pb36Ag2

   3.1 Melting point      : 175°C – 180°C

   3.2 Specific weight    : 7.85 g/cm3

   3.3 Wire diameter     : From 0.3 mm to 5 mm

   3.4 Working temperature: ~138°C - 210°C

   
   

   *FLUX RMA & RA

   Halide: 0.5 %

   Acidity index: N/A

   Non corrosive

   Solderability: Good on Copper substrates and excellent on surfaces of tin

SHENZEHN BBIEN TECHNOLOGY LIMITED's Sn62Pb36Ag2 No-Clean Flux for cored solder wire is halogen-free and halide-free with no intentional addition of bromine and chlorine, conforming to the strictest requirements of many sizes of specifications.
 

1.This binary soldering alloy is produced from first smelting of tin and antimony and conforms to the

standard - BS EN Alloy 18.

2 – CHEMICAL CHARACTERISTICS                 :

2.1 Amount of Tin                    : 62% ± 0.6%

2.2 Amount of Lead               : 36% ±0.5%

2.3 Amount of Silver                :2+/-0.5

2.3 Tin-lead-silver of first smelting purity

2.4 Chart of maximum impurities:

2.4 Available types of incorporated flux: