Feature
·         Excellent wettability and solderability;

·         Transparent residue and low solder ball rate;

·         Keep the stability in tackiness force of solder paste over 24hr.;

·         No change in viscosity during continuous printing;

·         Good spreading and bright solder joint.

·         Usage: Suitable for re-flow soldering

Briefly profile of Sn99Ag0.3Cu0.7 syringe solder paste
Sn99Ag0.3Cu0.7 is made with solder blenders, It is lead free, organic acid, water-soluble solder paste that provides users with the highest level of consistency performance. Batch after batch, SAC0307 provides hours of stable stencil life, tack time and repeatable brick definition. SAC0307 robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed.

The activator package in the SAC0307 is very aggressive and provides superior wetting to OSP coated and Immersion Silver boards. Generally used is type3 and type 4 powder.

BBIEN produces syringe packing solder paste with 100g/piece,100pieces per foam carton;We can add some ice bag into carton to keep the solderbility and storage situation of solder paste according to customers' requirement.
（Specification and chemistry component）

Specification	Sn99-Ag0.3Cu0.7
Appearance	black tacky paste
Weight	100g/syringe；10kg/ctn,100syringes per foam carton

 Metal composition of syringe Sn99Ag0.3Cu0.7 solder paste

Sort	Chemical composition (wt.%)
	Sn	Pb	Sb	Cu	Bi	Ag	Fe	Al	Cd
Sn99Ag0.3Cu0.7	Bal.	< 0.10	<0.10	0.7+/_0.1	<0.10	0.3±0.05	<0.02	<0.002	<0.002

Application:
BBIEN SAC0307 high temperature lead free solder paste is ideal used for precious computer motherboard, phone motherboard, printed circuit board (PCB), LED and SMT technique,as well as high-precision electronics circuit board. solder paste.

Packing:
The SAC0307 high temperature lead free solder paste could be classified as can/bottle packing and syringe packing type.
Each can/bottle holds the solder cream is 500g;
Each syringe can load the solder cream is 100g
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.
Specification and chemistry component）

Specification	Sn99-Ag0.3Cu0.7
Appearance	Black and gray tacky paste
Weight	500g/jar；10kg/ctn:500g/can or 100g/syring

Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for Sn99Ag0.3Cu0.7 pb free copper solder pasteto maintain consistent viscosity,reflow characteristics and overall performance.Sn99Ag0.3Cu0.7 copper solder pasteshould be stabilized at room temperature prior to printing. Sn99Ag0.3Cu0.7 silver copper solder pasteshould be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6-10 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).
 
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.

/