Feature:
ORH1 flux classification
Long stencil life and wide process window
Excellent wetting compatibility on most board
finishes and OSP
The following are general guidelines for stencil printer
optimization with Sn42Bi58. Some adjustments may
be necessary based on your process requirements.
rint Speed: 25-100 mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints,
> 8 hours @ 30-45% RH and 20-25oC
~ 4 hours @ 45-75% RH and 20-25oC
Cleaning
Sn42Bi58 can be cleaned using deionized water
at 40-60oC with a recommended water pressure of
30-50 PSI. Sn42Bi58can also be cleaned using
commercially available flux residue removers such as
Cleaning flux ,which is available from BBIEN.

Sn42Bi58 lead free Bi solders,this formulation exhibits long print life in continuous printing operations. Residue can be removed using. It is RoHS-compliant and increases production yields with its unparalleled lot-to-lot and stencil printing consistency, and offers superior print performance characteristics, including excellent wetting, strong activity, ideal viscosity.

Specification	Sn42Bi58
Appearance	gray tacky paste
Weight	500g/jar or 100g/syringe；10kg/carton

 

种类 Sort	化学成分Chemical composition (wt.%)
	Sn	Bi	Sb	Pb	Fe	Al	Cd
Sn42-Bi58	42±0.5	58±0.5	<0.02	<0.01	<0.02	<0.002	<0.003

BBIEN solder pastes classification as following:

No clean lead-free solder	melting point °C	Tensile strength	elongation reat%	expansion rate%	Size（um）	Application	Solder wire alloy	Solder bar alloy	Solder paste alloy	Solder powder alloy
Sn63Pb37	183		45	70	20~75	PCB	yes	yes	yes	yes
Sn96.5Ag3.0Cu0.5	217	40	58	78	12~75	SMD、SMT LED PCB，cellphone component	yes	yes	yes	yes
Sn99.0Ag0.3Cu0.7
Sn64Bi35Ag1	189	40	50	70	15~75	SMT,PCB	not	not	yes	yes
Sn62Pb36Ag2	189	38	54	75	25~75	SMT,PCB	not	not	yes	yes
Sn42Bi58	138	38	50	75	25~75	LED、	yes	Not	yes	yes

Application:
The Sn42Bi58 Bi series is designed to meet requirements for reliable solder joints in SMT PC board assemblies
 

 

Cleaning
Sn42Bi58 can be cleaned using deionized water
at 40-60oC with a recommended water pressure of
30-50 PSI. Sn42Bi58can also be cleaned using
commercially available flux residue removers such as
Cleaning flux ,which is available from BBIEN.
ncreased wetting on oxidized components
 Others informations
Compatible with enclosed print heads
RoHS II and REACH compliant
Print & Dispense grade solder paste available