Sn62Pb36Ag2 no clean lead solder paste
lead silver solder paste
Sn62Pb36Ag2 no clean lead solder paste
Sn62Pb36Ag2 lead silver solder paste  flux and resin lead solder paste have medium melting point of 179 degree,make excellent wettibility.BBIEN’s solder paste usually pack with 1005/syringe and 500g/jar.
Specification and chemistry component
Size of solder paste are available:type3,type4,type5,type6 and type7
Packing:50g,500g with jar packing
100g with syringe packing
Specification Sn62Pb36Ag2
Appearance Gray and black tacky paste
Packing 100g/syringe 500g/jar;10kg/foam carton

Chemical composition (wt.%)
Sn Pb Ag Cu Bi Zn Fe Al Cd
Sn62-Pb36-Ag2 62±0.5 36±0.5 20±0.2 0.08 <0.1 0.03 <0.02 <0.005 <0.002
Feature of Sn62Pb36Ag2 lead solder paste:

provides outstanding batch-to-batch consistency
· Excellent anti-slump characteristics minimizing bridging defects
· Capable of 60+ minute idle times in printing
· Capable of print speeds up to 150mm/sec (6in/sec)

· Excellent solderability to a wide variety of metallizations, including Palladium, leaving bright, shiny joints
· Residues easily removed with hot DI water, even up to 48 hours after soldering
· Minimal foam in wash systems

· 8+ hour stencil life
· Classified as ORM0 per J-STD-004
· Produces minimal voiding underneath BGA components
· Compatible with enclosed print head systems
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