BBIEN Sn63Pb37 solder paste's feature:
1.no clean solder paste specifically designed for resistance to environmental extremes. Water-soluble pastes tend to dry out in low relative humidity and slump at high relative humidity. Sn-Pb37 solder cream will maintain its print characteristics, tack and activity even after exposure to environmental extremes.

2.Very low BGA voiding, in conjunction with very high post reflow SIR readings make SN63PB37 ideal for tin lead soldering result (good and bright soldering point, less tin dross, excellent welding result)when lead components are used.

3.Sn63Pb37 solder paste, due to 36%tin mixed with 37%lead,that cause a very prefer soldering for kinds of electronics component.
It is an organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance.
Batch after batch, Sn63Pb37 solder paste provides hours of stable stencil life, tack time and repeatable brick definition.

Description for 63/37 paste solders
SN63PB37 is different due to its ability to withstand long, hot soak reflow profiles, allowing better wetting of lead free surfaces ith tin lead paste alloy. Very low BGA voiding, in conjunction with very high post reflow SIR readings make SN63PB37 ideal for tin lead soldering result (good and bright soldering point, less tin dross, excellent welding result)when lead components are used.

SN63PB37 is also a zero halogen product with very low halogens intentionally added to the formulation. BBIEN also can supply 100g per syringe packing solder paste,which need to use reflowing machines for spot welding technique.

Chemical datasheet:

Sort	Chemical composition (wt.%)
	Sn	Pb	Sb	Cu	Bi	Zn	Fe	Al	Cd
Sn63-Pb37	63±0.5	37±0.5	<0.20	<0.08	<0.1	0.03	<0.02	<0.005	<0.002

Other type of solder paste
 

No clean lead-free solder	melting point °C	Tensile strength	elongation reat%	expansion rate%	粒子大小（um）	Application	Solder wire alloy	Solder bar alloy	Solder paste alloy	Solder powder alloy
Sn63Pb37	183		45	70	25~75	印刷电路板PCB	yes	yes	yes	yes
Sn96.5Ag3.5	222	38	54	75	25~75	SMT	yes	yes	yes	yes
Sn96.5Ag3.0Cu0.5	217	40	58	78	25~75	SMD、SMT LED线路板、PCB板、	yes	yes	yes	yes
Sn99.0Ag0.3Cu0.7
Sn64Bi35Ag1	189	40	50	70	25~75	SMT,PCB	not	not	yes	yes
Sn62Pb36Ag2	189	38	54	75	25~75	SMT,PCB	not	not	yes	yes
Sn42Bi58	138	38	50	75	25~75	LED、	yes	Not	yes	yes

Packing carton:

Availability:
Tin leadsolder paste commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is recommended, but different powder particle size distributions are available for standard and fine pitch applications.  For specific packaging information see BBIEN’s Solder Paste Packaging Chart for available sizes. The appropriate combination depends on process variables and the specific application.

Packing for jar and syrnge solder paste
Each can/bottle holds the solder cream is 500g;
Each syringe can load the solder cream is 100g
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.
Specification and chemistry component）

Specification	Sn63Pb37 solder paste/cream
Appearance	Black and gray tacky paste
Packing	500g/jar；10kg/foam carton: 100g/syringe ,100syringes/carton

Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,reflow characteristics and overall performance. 63/37 solder paste should be stabilized at room temperature prior to printing. It should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material.
Shelf life is 6 to 8 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).
 
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product.
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