Type 7 silver solder paste SAC305
SAC305 solder paste
Type 7 silver solder paste SAC305

Solder paste is a form of solder that is used in PCB assembly, and including prototype PCB assembly, especially when using reflow soldering techniques. The solder paste is a mixture a solder spheres and a specialized form of flux. This means that the solder forms a form of paste that can be printed onto the surface of the printed circuit card in the required.
BBIEN  Technology Limited's type 7(2~12micron) solder paste SAC305 that is Sn96.5Ag3.0Cu0.5 is a no-clean formula. The residues do not need to be removed for typical applications. Although BBIEN SAC305 is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents.

Clients Zone:

For now,our type 7 SACX305 solder paste expored to Israel,Canada,Germany,France,Mid-Eastern Asia countries,and part of Eastern European contries.

we are appreciated your kindly inquiry and cooperations with you,if you are interested in our items.
type seven Sn96.5Ag3.0Cu0.5 no clean solder paste does require refrigeration if left at room temperature 3-10 degree for 6 months shelf life.

BBIEN Technology limited's type 7 Sn96.5Ag3.0Cu0.5 Solder paste basics

The solder particles are a mixture of solder. Traditionally this used to be tin and lead, but with the legislation being introduced around the world, there is a move to lead free solders. These may be made from a variety of mixtures. One is 96.5% tin and 3.0%silver and 0.5% copper, which has exllent soldering result performent.
BBIEN supply
 type 7 Sn96.5Ag3.0Cu0.5 silver solder paste has following feature:
1)Can print down to 8 mil x 8 mil apertures
2) Designed specifically for fine feature printing with T7 powder
3)Low QFN/BGA voiding
4) Excellent solderability with halogen-free chemistry
5)Optimized flux residues to mitigate head-in-pillow defects
6)Capable of print speeds up to 6 in/sec (150mm/sec)
·7)Low slump behavior minimizes defects

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