BBIEN Technology limited's type 7 Sn96.5Ag3.0Cu0.5 Solder paste basics
The solder particles are a mixture of solder. Traditionally this used to be tin and lead, but with the legislation being introduced around the world, there is a move to lead free solders. These may be made from a variety of mixtures. One is 96.5% tin and 3.0%silver and 0.5% copper, which has exllent soldering result performent.
BBIEN supply type 7 Sn96.5Ag3.0Cu0.5 silver solder paste has following feature:
1)Can print down to 8 mil x 8 mil apertures
2) Designed specifically for fine feature printing with T7 powder
3)Low QFN/BGA voiding
4) Excellent solderability with halogen-free chemistry
5)Optimized flux residues to mitigate head-in-pillow defects
6)Capable of print speeds up to 6 in/sec (150mm/sec)
·7)Low slump behavior minimizes defects
SHENZHEN BBIEN TECHNOLOGY LTD supply type 7 silver solder paste,just as the following specification,our solder paste are highly appreciated by clients arround the world.
Test Content--
Test Item |
Test Result |
Test Method |
Copper Plate Corrosion Test |
Pass |
JIS-Z-3197, 8.4.1 |
Spread Test |
> 75% |
JIS-Z-3197, 8.3.1.1 |
Copper Mirror Test |
Pass |
IPC-TM-650, 2.3.32 |
Viscosity Test(25 °C,10rpm) |
220 ± 30 Pa • s |
JIS-Z-3284. Annex 6 |
Tackiness Test (gf) |
> 130 (8hr) |
JIS-Z-3284. Annex 9 |
Slump Test |
Pass |
JIS-Z-3284. Annex 7, 8 |
Solder Ball Test |
Pass |
JIS-Z-3284. Annex 11 |
--Reliability Test--
S.I.R. Test ◊ |
> 1×109 Ω , Pass |
IPC-TM-650, 2.6.3.3 |
Electro Migration Test ♦ |
Pass |
IPC-TM-650, 2.6.14.1 |
◊ Test Conditions: 85 °C, 85% RH for 168 hrs ♦Test Conditions: 65 °C, 85% RH for 596 hrs
--Alloy Composition--
(Sn) |
(Ag) |
(Cu) |
(Ni) |
(Ge) |
(Zn) |
(Al) |
(Sb) |
(Fe) |
(As) |
(Bi) |
(Cd) |
(Pb) |
REM. |
2.8~3.2 |
0.3~0.7 |
0~0.01 |
0~0.01 |
0.001 MAX |
0.001 MAX |
0.05 MAX |
0.02 MAX |
0.03 MAX |
0.10 MAX |
0.002 MAX |
0.05 M |
Type 7 SAC305 solder paste REFLOW TIME PROFILE
Heating rate |
the time required to 120 ºC |
constant tem.
130 - 170ºC |
peak tem. |
> 220°C |
cooling rate |
1-3 ºC/sec |
< 60—90secs |
60—120secs |
< 245 ±5ºC |
< 40—80secs |
<4ºC / S |
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition fortype7 SAC305 lead free solder pasteto maintain consistent viscosity,reflow characteristics and overall performance. SAC305 lead free solder pasteshould be stabilized at room temperature prior to printing. SAC305 lead free solder pasteshould be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6-10 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).
Small knowledge of type 7 Sn96.5Ag3.0Cu0.5 silver lead free solder paste
How to use solder paste
When solder paste is used in mass PCB assembly as well as prototype PCB assembly there are a number of stages that are undertaken. First solder paste is applied to the printed circuit boards. The solder paste is only applied to the areas where solder is required. This is achieved using a solder paste stencil that only allows the solder paste through in certain areas. (Further information is available on another page in this section of the website).
Once the solder paste has been applied to the printed circuit board, it is then passed into the pick and place machine where the components are added. The solder paste has sufficient tension that it holds the components in place. However care should be taken not to knock the board at this stage otherwise the components may move of fall off. Additionally the board should be soldered within a few hours of being placed, otherwise the solder paste may deteriorate.
Any further information,please feel free to consult BBIEN TECHNOLOGY LTD's technician team.
Application of type7 SAC305 solder paste:
1)BBIEN can supply jar packing of 500g used for stenciling solder technique,SMD,SMT technology.
2)BBIEN can supply syring tube packing of 100g,which is used for dispensing technique,for some high quality electronics.
BBIEN Technology LTD type7 solder paste packing Details:
Packing could be classified as can/bottle packing and syringe packing type.
Each can/bottle holds the solder cream is 500g;
Each syringe can load the solder cream is 100g
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.
Specification |
Sn96.5Ag3.0Cu0.5 type7 |
Appearance |
gray tacky paste |
Weight |
500g/jar or 100g/syringe;10kg/carton |